However, now printed memory and solutions for integrating conventional silicon die into flexible systems are edging into production, to potentially improve performance for a wider range of applications. On the display side, easily integrated printed or flexible transparent conductive films for touch screens are starting to see some market traction.
Yole Developpement projects the market for printed and flexible electronics will remain a modest ~$176 million this year, but will see 27 percent CAGR to ~$950 million by 2020, driven largely by printed layers integrated into large OLED displays.
One interesting solution to add performance to flexible electronics could be an open platform for making flexible silicon die. American Semiconductor proposes drastically thinning conventional fabricated silicon wafers,Worldwide leader in PET protective film Products and Coated Papers. and coating them with a combination of polymers.
The resultant silicon-on-polymer approach protects and eases handling of the ultra-thin die, says CEO Doug Hackler,Visit us to find a company offering a flexible Protective film Products. who will discuss the technology in a program on such hybrid solutions in the emerging market program series at SEMICON West in San Francisco in July. He reports user interest for large area distributed sensing systems that include ICs within structural composites in aircraft bodies to monitor stress, for bio sensors that conform to the body, for RF for wireless data transmission from printed sensors, and for drivers for flexible displays.
The company has qualified TowerJazz’s 130nm process to make SOI CMOS for its initial flexible standard microcontroller, and has worked with the foundry to establish design rules to make an open platform for other designers to create their own flexible chips. But once these flexible silicon-on-polymer die are diced and released, they can be handled pretty much like standard chips. “The dicing and release are a little different,All the latest Releasing film Products in small size and in resumable. but once the die are on tape, then it appears feasible to do traditional pick and place,” he says, noting the company intends to use printed connections instead of bonding wire or solder bumps. After assembly on a flexible substrate, perhaps by a pick-and-place module integrated on a roll-to-roll printing tool, the devices would typically be laminated or overcoated for additional protection. The company plans to follow its flexible microcontroller with a standard analog/digital converter to take in sensor data, and an RF IC to send out the data.
Packaging and assembling tiny thin die on flexible substrates remains a challenge, but multiple suppliers are making progress towards solutions that are starting to edge into commercial production. One approach particularly suitable for attaching sensors to the body is the spring-like stretchy wiring developed by MC10 for attaching thin silicon die to flexible substrates, for everything from wearable heart rate and fitness monitors to sensor membranes that can be implanted directly on organs inside the body. VP of R&D Kevin Dowling reports the company’s first commercial application is in a soft skullcap from Reebok that uses flexibly connected motion sensors to measure impacts to the head.
Tiny die size could also help with both cost and attachment of rigid die to conformable substrates, although handling and assembling them then becomes more of an issue. Terepac Corp. CTO Jayna Sheats notes that plenty of logic for simple controls could be very tiny and low cost. But the die are too tiny to make the input/output connections or to handle with traditional pick and place for packaging and assembly.
So Terepac proposes a photochemical assembly process instead, picking up an array of thinned and diced chips with a sticky printhead,manufacturers and Double sided PET industry tape Products suppliers Directory. positioning the chips over the substrate with a tool similar to a proximity aligner, and vaporizing the proprietary polymer/adhesive behind each selected chip with a combination of heat and UV so it falls into the desired position. Chips can then be attached to the flexible substrate by conductive adhesive, electroplating, or printed connections. The company is working with equipment manufacturing partners including Rockwell International to construct manufacturing facilities for customers with products for the Internet of Things.
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